教育背景
2018.9~2022.7,中國科學院大學? 博士研究生
工作簡歷
2015.10~2018.3? ?中國科學院微電子研究所 研究實習員
2018.4~2023.11 ??中國科學院微電子研究所 助理研究員
2023.12至今 ??????中國科學院微電子研究所 副研究員微系統先進散熱技術
作為課題負責人/技術骨干參與多個重大、重點專項的科研任務
1.? Ye, Yuxin, Liu Ruiwen, Du, Xiangbin, Zhang Nan, Kong Yanmei, Jiao Binbin, Chen Dapeng. Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation[J]. Applied thermal engineering: Design, processes, equipment, economics, 2021, 195(1).
2.?Ye Y, Jiao B, Kong Y, et al. Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling[J]. Applied Thermal Engineering, 2022, 202: 117849.
3.?Cong B, Kong Y, Ye Y, et al. A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control[J]. Applied Thermal Engineering, 2023, 219: 119370.
4.?Zhang N, Jiao B, Ye Y, et al. Embedded cooling method with configurability and replaceability for multi-chip electronic devices[J]. Energy Conversion and Management, 2022, 253: 115124.
5.? Ye Y, Wu M, Kong Y, et al. Active thermal management of GaN-on-SiC HEMT with embedded microfluidic cooling[J]. IEEE Transactions on Electron Devices, 2022, 69(10): 5470-5475.
6.?Lu D, Ye Y, Liu R, et al. Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel[J]. IEEE Transactions on Electron Devices, 2023.
7.?Ye Y, Du X, et al. Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling[C]//2023 25th IEEE Electronics Packaging Technology Conference(IEEE EPTC).
8.? Ye Y, Lu G, Meng X, et al. Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling[C].// 2024 IEEE 23rd Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE ITherm).
9.?Ye Y, Yun,S, Liu R, et al. Application of Silicon Piezoresistive Effect In MEMS Embedded Microlfuidic Cooling[C].// 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems (IEEE MEMS).
10.?Zhang N, Ye Y, Liu Q, et al. Embedded microchannel cooler with manifold for IC chips[C]//2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (IEEE MEMS).?
已授權專利:
1.?葉雨欣,焦斌斌,孔延梅,陳大鵬. 自適應散熱裝置. ZL 202022031889.3.
2.?葉雨欣,焦斌斌,孔延梅,劉瑞文,陳大鵬. 熱電集成散熱模塊. ZL 202110234809.0.
3.?葉雨欣,焦斌斌,孔延梅,劉瑞文,陳大鵬. 熱管理監控模塊. ZL 202110234811.8
4.?焦斌斌,葉雨欣,孔延梅. 電子芯片及電子器件. ZL 202010658241.0
5.?孔延梅,張楠,焦斌斌,劉瑞文,葉雨欣,劉文寶. 一種多熱源散熱冷卻裝置以及冷卻方法. ZL202110218038.6.
6.?焦斌斌,孔延梅,云世昌,葉雨欣,陳大鵬. 封閉結構、其制作方法與器件. ZL 201810553113.2.
7.?王淵,焦斌斌,葉雨欣,孔延梅,陳大鵬. 流量信號的補償方法、裝置、存儲介質、處理器和系統. ZL201910299977.0
8.?焦斌斌,劉瑞文,云世昌,孔延梅,葉雨欣,杜向斌. 一種多傳感器組合結構及其加工方法、組合傳感器.ZL202210483866.7
1.?2022年獲中國儀器儀表學會科技進步一等獎(排名13)。
2.?IEEE-NEMS 2021會議最佳論文獎。
3.?IEEE ICEPT 2022會議最佳論文獎。
4.?中國科學院微電子研究所2022年度先進工作者。
人才隊伍